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Hi Sun FinTech Global Limited

Financial Service

0 ຄົນຕິດຕາມ

ລາຍລະອຽດວຽກໂດຍຫຍໍ້

  • English, Chinese, Lao

  • 1 - 2 Years

  • Bachelor Degree

  • Negotiable

  • Financial Service

  • Programming / Software Development, Information Technology(IT)

  • ປິດຮັບສະໝັກ: 04/Jul/2025
  • ຍອດເຂົ້າຊົມ: 264

ບັນທຶກວຽກ

Job Title 

Junior Banking Software Engineer & Internship 

 

Job Description

This is a position for junior banking software development engineer . You will be involved in the development and maintenance of the company's software products and provide technical support to our local banking customers. This position requires applicants to have software development capabilities and good communication and learning skills.

 

Key Responsibilities

  • Participate in the analysis, design, development, testing and maintenance of banking software systems;
  • Complete the design and coding of software modules according to project plans and design documents;
  • Provide software system support services to our banking customers;
  • Learn and apply new technologies to improve product performance and user experience.

 

Key Requirements

  • Bachelor degree or above, major in computer science or related science and engineering;
  • 1+ year of work experience or fresh graduates;
  • Familiar with at least one programming language (such as Java, Python, C++, etc.);
  • Fluent in Lao and English (Spoken and Written), Chinese proficiency is a plus
  • Good logical thinking and problem-solving skills;
  • Good communication skills and teamwork spirit;
  • Strong interest in software development and willingness to continuously learn new knowledge;
  • Strong initiative, positive and optimistic, good stress resistance; able to accept and adapt to work arrangements such as business trips or overtime
  • Excellent fresh graduates are welcome to apply, and internship opportunities can be provided.

Benefits:

  • The company provides local social security and paid annual leave, a complete training system and promotion mechanism:
  • The company provides industry-competitive salaries, project awards, year-end bonuses, etc., and living allowances during internships.
  • The company organizes overseas study and work opportunities from time to time

Rich team activities (regular team building activities, travel, annual meetings, etc.)

 

How to Apply:

Interested applicants should submit their CV and Cover letter to: lucy.lu@hisunglobal.com (Only short listed candidates will be notified and invited for interview)

Closing date for applications: 6 July 2025